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When Ceramer and Ceramerplus are used as an additive in other polymers, metallization is drastically improved there too.
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Here again, an approximately 240 nm thick film of copper was applied to the substrate by sputtering. The bond strength between the copper film and the substrate was determined using the peel-off method.
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The thickness of the copper film can also be raised using electrochemical deposition. |
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Adhesive strength of sputtered copper to unfilled high performance polymers and those filled with Ceramer.
LCP: Liquid crystalline polyester; PSU: Polysulfone
PEEK: Polyetheretherketone; PAI: Polyamideimide
PESU: Polyethersulfone |
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