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Non-polar fluoropolymers are notoriously difficult to metallize because of their poor adhesion to other materials, notably metals. This causes severe problems when molded parts have to be metallized for electronic applications such as printed circuit boards.
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Fluoropolymers are often not even considered for this type of application, despite the fact that their electrical properties would be ideal for the purpose. By incorporating the polar Ceramer, or extremely polar Ceramerplus, adhesion to metals such as copper can be drastically increased. Here it must be ensured that there is always a sufficient amount of Ceramer on the substrate surface.
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No significant change in the electrical properties of fluoropolymers filled with Ceramer was observed when compared to unfilled fluoropolymers. |
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3-D printed circuit board with improved adhesion
of the printed conductors through Ceramer. |
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