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For the tests, an approximately 240 nm thick film of copper was applied to the substrate by sputtering. The bond strength between the copper film and the substrate was subsequently determined by the peel-off method. The data confirms a clear improvement of the adhesion to metals.
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The increase of the polar share of the surface tension of the fluoropolymer substrate is the main reason for this.
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The thickness of the copper film can be raised further using electrochemical deposition. |
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| Adhesion of sputtered copper on substrates made from unfilled fluoropolymers and fluoropolymers filled with diverse reinforcing materials. |
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